Caricamento in corso...
PCB Design
01SNDRV
A.A. 2024/25
Course Language
Inglese
Degree programme(s)
Doctorate Research in Ingegneria Elettrica, Elettronica E Delle Comunicazioni - Torino
Course structure
| Teaching | Hours |
|---|---|
| Lezioni | 10 |
| Esercitazioni in aula | 20 |
Lecturers
| Teacher | Status | SSD | h.Les | h.Ex | h.Lab | h.Tut | Years teaching |
|---|---|---|---|---|---|---|---|
| Fiori Franco | Professore Ordinario | IINF-01/A | 7 | 0 | 0 | 0 | 1 |
Co-lectures
Context
| SSD | CFU | Activities | Area context | *** N/A *** |
|---|
Lo schema di un circuito elettrico/elettronico non rappresenta il passo conclusivo del progetto ma quello iniziale. Di solito, il circuito reale (il prototipo) è realizzato sottoforma di circuito stampato (PCB) che ospita e collega tra loro i componenti attivi e passivi di cui esso è composto. Tuttavia, il funzionamento del circuito e le sue prestazioni sono strettamente collegate al progetto fisico (vista layout) del PCB e al modo in cui esse è collegato al resto del sistema.
Questo corso presenta un approccio al progetto dei circuiti stampati di tipo top-down che permette di affrontare i principali problemi di integrità dei segnali e di trasferimento del calore. Le esercitazioni CAD saranno facendo riferimento ai comuni tools di progettazione come Altium designer, HFSS Ansys (SIPI) e Comson (analisi termica).
The schematic view of an electric/electronic circuit does not represent the final step of the project but the initial one. Usually, real circuits like prototypes are implemented in the form of a printed circuit boards (PCBs) hosting and connecting to each other the passive and active components the circuit is made of.
However, the operation of the circuit as well as its performances are strictly related to the physical design (layout view) of the PCB itself and to the way it is connected to the rest of the system.
This course presents a top-down approach for the design of PCBs comprising analog digital and power sections, which allows one to address common signal and power integrity (SIPI) issues as well as thermal issues.
The laboratory exercises are carried out referring to CAD tools of common use for the design of PCBs like Altium designer, HFSS Ansys (SIPI analysis), and Comsol (Thermal analysis).
Circuit theory, analog electronics, power electronics
Circuit theory, analog electronics, power electronics
• Materials and fabrication process
• PCB planning, partitioning and stack-up definition
• PCB grounding of analog, digital, power sections.
• Trace routing and power/signal integrity issues.
• Thermal analysis and mechanical stresses
• Analysis of case studies for mixed signals PCB and power converters
• Materials and fabrication process
• PCB planning, partitioning and stack-up definition
• PCB grounding of analog, digital, power sections.
• Trace routing and power/signal integrity issues.
• Thermal analysis and mechanical stresses
• Analysis of case studies for mixed signals PCB and power converters
In presenza
On site
Presentazione report scritto
Written report presentation
P.D.1-1 - Febbraio
P.D.1-1 - February