The aim of the course is to provide the theoretical basics to study materials and technologies for the design and the fabrication of microelectronic devices, micro and nanostructures and microsystems, with particular emphasis on applications in the ICT area. The course is focused around three main topics advanced FET transistor (FinFET, Tunnel FET, Gate All Around FET), post-transistor emerging technologies (Molecular and Atomic Devices, Magnetic Memories and Logic Devices, Resistive Memories) and microsystems (MEMS). The course of Nanoelectronic Systems is focused on the description of these systems and how they work, while the course of Technology for Nanoelectronic Systems describe the fabrication process of such systems. This course plays a central role in the development of an Engineer expert in micro and nanotechnologies, because it extensively provides the basic elements for the fabrication and design of the above mentioned systems.

Expected knowledge: - Development of knowledge that extends and/or reinforces the ones received from preparatory courses and allow to develop and/or apply original ideas and design methods and the development of a technological process flow for the production of nano and microsystems; - Ability to apply the knowledge gained in a research and/or industrial framework, understanding capability and skills in solving problems related to the design, modeling, simulation and implementation of nano and microsystems also applied to new technological principles or unfamiliar issues or entered into application contexts broader and more interdisciplinary than the engineering sector (medicine, environmental monitoring, food, ...); - Ability to integrate technical knowledge and to manage the complexity of the design and manufacturing process flow, to evaluate the quality and robustness of a process flow, its implementation and feasibility, choosing the most efficient solutions from the available options; - Ability to communicate in a clear and unambiguous way technical aspects relating to the design and manufacture of nano and microsystems, both in writing and oral form and to both specialists and non-specialists; - Development of self-learning skills to allow the student to continue to learn autonomously new techniques and design methodologies and fabrication techniques for nano and micro and nano systems, not necessarily explained and described during the course. Expected skills - Knowledge of the physical-chemical behaviour of materials to be used in nanosystems. - Knowledge of the basic technologies for nanostructures fabrication. - Knowledge of materials and technologies for nano and microsystems. - Ability to apply materials and technologies for the fabrication of nanostructures and nanosystems. - Knowledge of models and methodologies used for the description and the design of nanosystems. - Knowledge of methods and CAD for nanosystems design and simulation. - Ability to design component for nano and microsystems. - Knowledge of techniques and issues related to the design, fabrication and verification of nanosystems. - Ability to co-design nanosystems and standard electronic circuits.

- Elementary physics (mechanics, thermodynamics, elements of structure of matter). - Elements of electronics. - Deep knowledge of MOS systems and MOSFET devices. - Good knowledge of fabrication processes for ICT technologies. - Modelling of nanoscale devices (2D,1D). - Good knowledge of magnetism

Technology for Nanoelectronic Systems --------------------------------------------------------- Technology for MOS systems: - Advanced MOS processes; - 3D integration technology; - Heterogeneous integration technology; - Simulation of process workflow for MOS systems. Technologies for nanosystems: - Atomic Layer Deposition; - Atomic Layer Etching; - Techniques for single atoms/molecules manipulation. - Self-Assembly techniques; - Nanoimprinting; - Resistive and 3D memories. Technology for microsystems Nanoelectronic Systems -----------------------------------

Technology for Nanoelectronic Systems --------------------------------------------------------- The course is organized in theoretical lectures and laboratory exercises. The course topics will be described considering some relevant cases of study: - FinFet/Tunnel Fet; - MEM sensors; - Molecular/Atomic circuits; - Magnetic Hard Drives; - Self-Assembled systems; - Resistive memories. For each of them will be analyzed the technological processes used for the integration in pervasive nanosystems which will be of high added values for many applications. The classes will be ONLY online for the 2020/2021 academic year. The laboratory exercises are instead focus on the simulation of the process workflow for MOS circuits. Finite element simulators able to simulate all fabrication processes used for planar circuits will be used to emulate all fabrication steps of a device. The laboratory can be done online, onsite or partially online and onsite. Nanoelectronic Systems -----------------------------------

Lectures notes will be provided to the students by the teachers as an integration to the lessons.

Modalità di esame: Prova orale obbligatoria; Elaborato scritto prodotto in gruppo;

Exam: Compulsory oral exam; Group essay;

... The exam consists in two parts. 1) Laboratory reports: The laboratories will require a report on each subject and will be evaluated for the final exam (25%). 2) Oral exam: The oral exam will be on the whole subject (75%). Exam rules - Laboratory reports: A single report describing all the laboratories must be delivered before the end of January. For each of the four laboratories the report must describe the design of the device complete with all the choices done, how the device was implemented within the simulation environment and the results obtained. Laboatory reports are expected to be complete and well presented and connected to the theory analyzed in the lectures. Critical thinking will be especially evaluated. Laboratory reports are evaluated over a maximum score of 30 Lode. -Oral exam: the exam is based on three to six questions on the whole subject. During the oral exam the students will be evaluated based on the following objectives: - Knowledge of the structure and fabrication of advanced MOS devices; - Knowledge of fabrication processes for beyond CMOS systems; - Knowledge of MEMS technology for sensors; - Knowledge of fabrication processes simulations tools and activities carried on during the laboratories. The oral exam is evaluated over a maximum score of 30 Lode. The final mark will be calculated using a weighted sum of the laboratory and oral part.

Gli studenti e le studentesse con disabilità o con Disturbi Specifici di Apprendimento (DSA), oltre alla segnalazione tramite procedura informatizzata, sono invitati a comunicare anche direttamente al/la docente titolare dell'insegnamento, con un preavviso non inferiore ad una settimana dall'avvio della sessione d'esame, gli strumenti compensativi concordati con l'Unità Special Needs, al fine di permettere al/la docente la declinazione più idonea in riferimento alla specifica tipologia di esame.