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Physics of technological processes

01VJXPE

A.A. 2023/24

Course Language

Inglese

Course degree

Master of science-level of the Bologna process in Nanotechnologies For Icts (Nanotecnologie Per Le Ict) - Torino/Grenoble/Losanna

Course structure
Teaching Hours
Teachers
Teacher Status SSD h.Les h.Ex h.Lab h.Tut Years teaching
Teaching assistant
Espandi

Context
SSD CFU Activities Area context
FIS/03 6 C - Affini o integrative Attività formative affini o integrative
Valutazione CPD 2021/22
2022/23
The course is taught in English. Aim of the course (1st semester, 1st year of the International LM in Nanotechnologies for ICT) is to provide the theoretical basics to be exploited in the study of materials, technologies and design for realization of microelectronic devices, micro and nanostructures, microsystems and MEMS/NEMS (micro/nano-electro-mechanical systems), with particular emphasis on applications in the ICT area. This course plays a central role in the development of an Engineer expert in micro an nanotechnologies, because it extensively provides the basic elements for the fabrication and design of the above mentioned devices and it is preparatory for the understanding of subsequent courses of the Laurea Magistrale. In the course the fundamentals of technologies and material for microelectronics and microsystems and some examples of the same are treated and discussed, thus making the course specifically addressed to those students interested in the fabrication and design aspects of micro and nano-scale devices.
The deepening on technologies at the micro and nano-scale is the basis for the design and manufacture of microelectronic devices, microsensors, microfluidics and for the conception of new nanostructured devices. Technological processes therefore represent a fundamental know-how for both the electronic and the nanotechnology engineer. In this framework, the "Physics of technological process" course provides the theoretical foundation to be exploited in the study of materials, technologies and design for the manufacturing of microelectronic devices, micro and nanostructures, microsystems and MEMS/NEMS (micro/nano-electro-mechanical systems), with particular emphasis on applications in the ICT area. To this aim, particular emphasis will be devoted to provide a comprehensive overview of full process flows and to provide the student with the minimal tools to allow him evaluating different materials and different technological processes so as to select the best suited combination for different devices and applications. This course plays a central role in the development of an Engineer expert in micro and nanotechnologies, since it extensively provides the basic elements for the fabrication and design of the above mentioned devices and it is preparatory for the understanding of subsequent courses of the Master Degree. In the course the fundamentals of technological processes and materials for microelectronics and microsystems and some examples of the same are treated and discussed, thus making the course specifically addressed to those students interested in the fabrication and design aspects of micro and nano-scale devices.
Expected knowledge: • development of knowledge that extends and/or reinforces the ones received from preparatory courses and allow to develop and/or apply original ideas and design methods and the development of a technological process flow for the production of integrated circuits and microsystems; • ability to apply the knowledge gained in a research and/or industrial framework, understanding capability and skills in solving problems related to the design, simulation and implementation of microelectronic circuits and microsystems also applied to new or unfamiliar issues or entered into application contexts broader and more interdisciplinary than the engineering sector (medicine, environmental monitoring, food, ...); • ability to integrate technical knowledge and to manage the complexity of the design and manufacturing process flow, to evaluate the quality and robustness of a process flow, its implementation and feasibility, choosing the most efficient solutions from the available options; • ability to communicate in a clear and unambiguous way technical aspects relating to the design and manufacture of integrated circuits and microsystems, both in writing and oral form and to both specialists and non-specialists; • development of self-learning skills to allow the student to continue to learn autonomously new techniques and design methodologies and fabrication techniques for integrated circuits and microsystems, not necessarily explained and described during the course. Expected skills • Knowledge of the physical-chemical behaviour of materials to be used in micro and nanotechnologies. • Knowledge of the basic technologies for microstructure realization. • Knowledge of materials and technologies for Microsystems and MEMS realization. • Ability to apply materials and technologies for realization of microstructure and microsystems. • Knowledge of techniques and issues related to the fabrication and verification of nanosystems.
Expected knowledge: • development of knowledge that extends and/or reinforces the ones received from preparatory courses and allow to mature and/or apply original ideas and design methods to the development of a new technological process flow for the production of integrated circuits and microsystems; • knowledge of the physical-chemical behaviour of materials to be used in micro and nanotechnologies. • knowledge of the basic technologies for microstructures fabrication. • knowledge of materials and technologies for Microsystems and MEMS fabrication. • knowledge of techniques and issues related to the fabrication and verification of nanosystems. Expected competences and skills • ability to identify and select the most suited and to apply materials and technologies for the fabrication of microstructures and microsystems. • ability to apply the acquired knowledge in a research and/or industrial framework, applying capability and skills in solving problems related to the design, simulation and implementation of microelectronic circuits and microsystems also in the case of new or unfamiliar issues or entered into broader and more interdisciplinary application contexts than the pure engineering sector (medicine, environmental monitoring, food, ...); • ability to integrate technical knowledge and to manage the complexity of the design and manufacturing process flow, to evaluate the quality and robustness of a process flow, its implementation and feasibility, choosing the most efficient solutions from the available options; • ability to communicate in a clear and unambiguous way technical aspects related to the design and manufacture of integrated circuits and microsystems, both in writing and oral form and to both specialists and non-specialists; • development of self-learning skills to allow the student to continue to learn autonomously new techniques and design methodologies and fabrication techniques for integrated circuits and microsystems, not necessarily explained and described during the course.
• Elementary physics (mechanics, thermodynamics, wave optics, elements of structure of matter) • Elements of modern physics • Elements of electronics • Elements of electronic devices
• Elementary physics (mechanics, thermodynamics, wave optics, fluidics, elements of structure of matter) • Elements of modern physics • Elements of electronics • Elements of electronic devices • Elements of chemistry and materials science • Knowledge of the micro and nano-scale characterization techniques (SEM, TEM, AFM, Raman, XRD, XPS, profilometry, ...)
Integrated Circuits technologies (wafer preparation, cleanroom technology, silicon oxidation, epitaxy, CVD, evaporation, sputtering, electroplating, diffusion, ion implantation) (2 ECTS) Lithographic techniques, wet etching, dry etching, back-end technologies, CMOS process flow (2 ECTS) Introduction to MEMS and NEMS, bulk micromachining, surface micromachining, LIGA, wafer bonding, MEMS packaging, MEMS complementary technologies (2 ECTS)
Integrated Circuits technologies (wafer preparation, cleanroom technology, silicon oxidation, epitaxy, CVD, evaporation, sputtering, electroplating, diffusion, ion implantation) (2 ECTS) Lithographic techniques, wet etching, dry etching, back-end technologies, CMOS process flow (2 ECTS) Introduction to MEMS and NEMS, bulk micromachining, surface micromachining, LIGA, wafer bonding, MEMS packaging, MEMS complementary technologies (2 ECTS). No distinction to be reported for the content of the course according to the fact that it will be carried out in presence or remotely.
The course consists of lectures delivered by slides and the use of the blackboard. The slides will be made available to students on the Internet Didactic Portal at the beginning of the course.
The course consists of lectures covering the topics described in the Course Topics section, delivered by slides and the use of the blackboard (or alternative tools like graphical tablet or similar in case of remote or blended lectures). The slides will be made available to students in pdf format on the Internet Didactic Portal at the beginning of the course. Laboratory practice sessions will also be organized to allow students to become familiar with some basic technologies for devices manufacturing (e.g. lithography)
The didactic material (slides for the lectures) will be distributed by teachers. Suggested but not mandatory books will be specified by the teacher. Among them: - “Microsystem Technology”, W. Menz, J. Mohr, O.Paul, Wiley-VCH ed.
The didactic material (slides for the lectures) will be distributed in pdf format by the teacher and uploaded on the Didactic Portal before the course start. All the lectures will be moreover recorded and related videos made available on the Didactic Portal. Suggested but not mandatory additive readings and books will be specified by the teacher. Among them: - “Microsystem Technology”, W. Menz, J. Mohr, O.Paul, Wiley-VCH ed.
Modalità di esame: Prova scritta (in aula);
Exam: Written test;
The exam involves a written proof including both multiple-answer questions and open questions and short exercises. The total allotted time is 60 mins. The type of proposed questions aims to test the student ability to understand and revision the topics covered in class lectures, with particular reference to the ability to compare similar technologies, compare results or processing parameters of technological processes or performance of different materials. The main evaluation criteria of the exam consist in the correctness of the tests solutions, the completeness and synthesis of the responses to the open questions and the correctness of the employed technical language.
Gli studenti e le studentesse con disabilità o con Disturbi Specifici di Apprendimento (DSA), oltre alla segnalazione tramite procedura informatizzata, sono invitati a comunicare anche direttamente al/la docente titolare dell'insegnamento, con un preavviso non inferiore ad una settimana dall'avvio della sessione d'esame, gli strumenti compensativi concordati con l'Unità Special Needs, al fine di permettere al/la docente la declinazione più idonea in riferimento alla specifica tipologia di esame.
Exam: Written test;
Expected learning outcomes Understanding of the covered topics and ability to grasp the fundamental aspects of the various technologies and related materials. Ability to compare (advantages/disadvantages) the different technological tools for the manufacture of a device. Ability to compare, identify and logically use the best technological tools in order to optimize the manufacturing process of a device. Ability to build a logical path by assembling the various technological processes, for the construction of a micro and nano-scale device. Criteria, rules and procedures for the examination The exam is aimed at ascertaining the knowledge of the topics listed in the official program of the course and the ability to apply the theoretical contents for the solution of simple exercises for the assembly of technological processes. The exam involves a written proof including both multiple-answer questions and open questions and short exercises. The total allotted time is 60 mins. No books, notes or any other didactic material is allowed. No negative points for the wrong multiple-answer questions, while missing answers will be considered as "0 points" on the cumulative result of the final mark. The assessments are expressed in thirtieths and the exam is passed if the mark is at least 18/30. The maximum achievable mark is 30 cum laude. The type of proposed questions aims to test the student ability to understand and revision the topics covered in class lectures, with particular reference to the ability to compare similar technologies, compare results or processing parameters of technological processes or performance of different materials. The main evaluation criteria of the exam consist in the correctness of the tests solutions, the completeness and synthesis of the responses to the open questions and the correctness of the employed technical language. The exam results are communicated directly to students at the end of the written exam revision by the teacher.
In addition to the message sent by the online system, students with disabilities or Specific Learning Disorders (SLD) are invited to directly inform the professor in charge of the course about the special arrangements for the exam that have been agreed with the Special Needs Unit. The professor has to be informed at least one week before the beginning of the examination session in order to provide students with the most suitable arrangements for each specific type of exam.
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