The schematic view of an electric/electronic circuit does not represent the final step of the project but the initial one. Usually, real circuits like prototypes are implemented in the form of a printed circuit boards (PCBs) hosting and connecting to each other the passive and active components the circuit is made of. However, the operation of the circuit as well as its performances are strictly related to the physical design (layout view) of the PCB itself and to the way it is connected to the rest of the system. This course presents a top-down approach for the design of PCBs comprising analog digital and power sections, which allows one to address common signal and power integrity (SIPI) issues as well as thermal issues. The laboratory exercises are carried out referring to CAD tools of common use for the design of PCBs like Altium designer, HFSS Ansys (SIPI analysis), and Comsol (Thermal analysis).

Circuit theory, analog electronics, power electronics

• Materials and fabrication process • PCB planning, partitioning and stack-up definition • PCB grounding of analog, digital, power sections. • Trace routing and power/signal integrity issues. • Thermal analysis and mechanical stresses • Analysis of case studies for mixed signals PCB and power converters

On site

Written report presentation

P.D.1-1 - February