Politecnico di Torino
Politecnico di Torino
Politecnico di Torino
Academic Year 2009/10
Physics of technological processes and microsystems
Master of science-level of the Bologna process in Nanotechnologies For Ict Engineering - Torino/Grenoble/Losanna
Teacher Status SSD Les Ex Lab Tut Years teaching
Cocuzza Matteo ORARIO RICEVIMENTO     5 0 0 0 5
SSD CFU Activities Area context
FIS/03 5 A - Di base Fisica e chimica
Objectives of the course
To provide the basics of technologies for microelectronics and microsystems
Microelectronic Technology: wafer preparation, crystalline defects, epitaxy, CVD and PVD of dielectric and conductive films, oxidation, diffusion and implantation, lithography (optical, x-ray, e-beam, ion-beam), wet and dry etching, wafer cleaning, metallization, back-end technologies (passivation, CMP, wire bonding, die bonding, packaging, '), CMOS process flow, cleanroom technology.
Introduction to the Microsystems world: keypoints, advantages, dimensions, scaling, history, applications, potential
Materials for microsystems: types of materials, new technologies, motivations, high aspect ratio structures, the problem of adhesion and surface effects, the stress, types of substrates
Bulk micromachining: front and back-side, anisotropic etching, p++ etch-stop, electrochemical etch-stop, vapour etching, dry etching, DRIE
Surface Micromachining: structural and sacrificial materials, examples, stiction and techniques to avoid, hinged microstructures
LIGA micromachining: principles, the resist, x-ray sources, scanners, electroplating, micro-molding and hot-embossing, LIGA device examples, SU-8, soft-lithography, micro-stamping, HEXSIL
Wafer bonding: principles, anodic, fusion, glas frit, eutectic, adhesive bonding, examples of applications, equipments
Other technologies: ultrasonic machining, powder blasting, laser machining, micro-electro discharge machining, FIB, micro stereo lithography, chemical mechanical polishing, EFAB, e-beam and SPM lithographies
MEMS foundries and commercial process flows: foundries and working principles, MUMPS process, SUMMIT process, MOSIS, the concept of distributed facilities and Multi-Project Wafer, integration of MEMS and IC
Exercises and laboratories
Semiconductor Devices: Physics and Technology, 2nd Edition
Simon M. Sze, Wiley 2001

Programma definitivo per l'A.A.2009/10

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