Politecnico di Torino
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Politecnico di Torino
Academic Year 2015/16
01OUXPE, 01OUXOT, 01OUXOV
Advanced design for signal integrity and compliance
Master of science-level of the Bologna process in Nanotechnologies For Icts - Torino/Grenoble/Losanna
Master of science-level of the Bologna process in Telecommunications Engineering - Torino
Master of science-level of the Bologna process in Computer Engineering - Torino
Teacher Status SSD Les Ex Lab Years teaching
Canavero Flavio ORARIO RICEVIMENTO PO ING-IND/31 48 12 0 6
SSD CFU Activities Area context
ING-IND/31 6 D - A scelta dello studente A scelta dello studente
Esclusioni:
01OVA; 01OUW; 01OVD; 01OVC; 01OVF; 01OVE; 01OUZ; 01OUY; 01OVB
ORA-01722: invalid number
Subject fundamentals
The course is taught in English.

The aggressive miniaturization of current and future generation electronic and communication systems, such as smartphones and tablets, combining different functions (digital, analog and RF, optical, bio-sensors, MEMS, etc.) in a very compact volume, poses tremendous design challenges. Unwanted interactions between different system parts may lead to performance degradation and malfunctioning, unless proper design strategies are applied to guarantee the Signal and Power Integrity of the system. This course provides a fundamental understanding of main signal/power deterioration causes, as well as suitable strategies aimed at robust system design and reliability.
Expected learning outcomes
The student attending the course will learn how to

- understand the main mechanisms of signal and power deterioration in electronic systems
- analyze qualitatively and quantitatively and provide simple models for most common signal/power integrity issues
- apply design methods and tools to maximize system reliability
Prerequisites / Assumed knowledge
Circuit theory and basic electromagnetics.
Contents
Introduction to signal and power integrity aware design. Modeling and simulation approaches.

Physical description, models, and design rules for electrical interconnects. Signal integrity effects: crosstalk and losses. Robust signaling schemes. Shielding and twisting.

Power distribution systems and power integrity at chip, package and board level.

Electromagnetic interference and radiation. Immunity.

Shielding and Grounding.