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Thesis proposals - LUCIANO SCALTRITO
Topic
Company
Abroad
3D Printing Ceramic Materials for Microelectronic Applications
P
N
AI Techniques for the Optimisation of DBC Substrates for High Power Systems-in-Package (HPSiP)
P
N
AI Techniques for the Optimisation of Highly Integrated Power Modules
P
N
Additive manufacturing of ceramic materials
P
N
Die Attach Process Optimisation for System-in-Package modules
P
N
Laser processes on packaging materials
P
N
Modelling Pyroelectric Effect for Piezoelectric Sensor Integration
P
N
Packaging optimization for a microfluidic platform
P
N
Piezoelectric Sensor Integration beyond linearity
P
N
Pore Structure Investigation in Die Attach and Solder joints
P
N
Power devices passivation layers: materials and processes optimization
A
N
Power semiconductor devices – Contact resistance
P
N
Silicon Carbide Schottky Barrier height formation and measurements
P
N
Warpage Mitigation of Electronic Ceramic Substrates
P
N