| KEYWORD |
AA - Materials and Processes for Micro and Nano Technologies
Warpage Mitigation of Electronic Ceramic Substrates
keywords ELECTRONICS DEVICES, PCB DESIGN, EMBEDDED BOARD, VEHICULAR COMMUNICATIO
Reference persons VALENTINA BERTANA, LUCIANO SCALTRITO
Research Groups AA - Materials and Processes for Micro and Nano Technologies
Thesis type EXPERIMENTAL - DEVELOPMENT
Description Ceramic substrates are ubiquitous in modern electronics, providing a robust
platform for mounting electronic components. However, one critical issue that can
significantly impact the performance and reliability of these devices is warpage.
Warpage, a distortion or bending of the substrate, can arise from various factors,
including thermal expansion mismatches, internal stresses, and manufacturing
processes. [1]
The thesis seeks to understand and address the issue of warpage by simulating
potential solutions and validating them through sample production.
The work will be organised as follow:
• Literature review
• Design and FEM Simulation of warpage-optimised substrates
• Substrates Production
• Results characterisation
[1] Hu et al, Warpage deformation analysis of AMB ceramic substrates in power
modules, 2024
Required skills 3D CAD design
Design and FEM simulation
Deadline 13/12/2025
PROPONI LA TUA CANDIDATURA