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Prof. SERGIO FERRERO

AI Techniques for the Optimisation of DBC Substrates for High Power Systems-in-Package (HPSiP)  BERTANA VALENTINA  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
AI Techniques for the Optimisation of Highly Integrated Power Modules  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Connessioni Die-to-die e die-to-wafer: Cu-Cu e Al-Al bonding  BERTANA VALENTINA  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Die-to-die and die-to-wafer connection: Cu-Cu and Al-Al bonding  BERTANA VALENTINA  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Modellizzazione dell'effetto piezoelettrico per l'integrazione di un sensore  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Ottimizzazione del packaging di una piattaforma microfluidica  BERTANA VALENTINA  SCALTRITO LUCIANO
Piezoelectric Sensor Integration beyond linearity  BERTANA VALENTINA  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Pore Structure Investigation in Die Attach and Solder joints  BERTANA VALENTINA  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
azienda TESI AZIENDA Power devices passivation layers: materials and processes optimization  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Power semiconductor devices – Contact resistance  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies
Silicon Carbide Schottky Barrier height formation and measurements  SCALTRITO LUCIANO  AA - Materials and Processes for Micro and Nano Technologies