| KEYWORD |
Advanced 3D-ICE Thermal Modelling: Driving Innovation in High-Performance Computing Architecture Design
Thesis in external company 
Thesis abroad
keywords ARM, C, COMPILERS, DESIGN SPACE EXPLORATION, EMBEDDED SYSTEMS, ENERGY EFFICIENCY, FIRMWARE, HARDWARE AND SOFTWARE, HARDWARE DESIGN, LOW POWER, MICROCONTROLLERS, THERMAL, THERMAL MODEL
Reference persons DANIELE JAHIER PAGLIARI
External reference persons Yukai Chen (IMEC)
Research Groups DAUIN - GR-06 - ELECTRONIC DESIGN AUTOMATION - EDA, ELECTRONIC DESIGN AUTOMATION - EDA, GR-06 - ELECTRONIC DESIGN AUTOMATION - EDA
Thesis type EXPERIMENTAL, HARDWARE DESIGN, SOFTWARE DEVELOPMENT
Description This thesis will be carried out at the IMEC research center in Leuven, Belgium.
Modern computing demands are reaching unparalleled heights, and with them, the necessity for advanced, 3D Integrated Circuits (3D ICs) capable of propelling performance and scalability in our increasingly digital world. These stacked memory and logic blocks form the cornerstone of future technology, yet they present an intriguing thermal challenge due to their high power densities.
In this thesis, the candidate will explore system-level thermal dynamics within cutting-edge, multicore High-Performance Computing (HPC)/server architectures. The student will employ the 3D Interlayer Cooling Emulator (3D-ICE) - a state-of-the-art thermal CAD tool adept at solving heat transfer equations in intricate 3D structures and focusing on fast transient state thermal estimation. Namely, the candidate will employ 3D-ICE to benchmark thermal performance in the different 3D integration configurations with the vanguard of technology nodes, including various system architecture partitioning schemes: memory-on-logic, logic-on-memory, and memory-on-memory, investigated within the grand scope of a complete chip-substrate-package level design. Throughout this venture, the candidate will collaborate closely with a team of expert system architects and thermal designers at IMEC, to discover and unlock the potential of system-level thermal solutions.
Required skills Electronic / Computer engineering, Experience with EDA tools for power and/or thermal analysis, C/C++, Python, basic knowledge of SOC packaging.
Notes Thesis carried out at the IMEC research center in Leuven, Belgium, under the supervision of Dr. Francky Catthoor, Dr. Yukai Chen, and Dr. Dwaipayan Biswas. The candidate will be financially supported by IMEC for the travel (around 800/1000 Euro per month, not considering potential scholarships).
Deadline 08/08/2023
PROPONI LA TUA CANDIDATURA