| KEYWORD |
Advanced 3D-ICE Thermal Modelling: Driving Innovation in High-Performance Computing Architecture Design
Tesi esterna in azienda 
Tesi all'estero
Parole chiave ARM, C, COMPILERS, DESIGN SPACE EXPLORATION, EMBEDDED SYSTEMS, ENERGY EFFICIENCY, FIRMWARE, HARDWARE AND SOFTWARE, HARDWARE DESIGN, LOW POWER, MICROCONTROLLERS, THERMAL, THERMAL MODEL
Riferimenti DANIELE JAHIER PAGLIARI
Riferimenti esterni Yukai Chen (IMEC)
Gruppi di ricerca DAUIN - GR-06 - ELECTRONIC DESIGN AUTOMATION - EDA, ELECTRONIC DESIGN AUTOMATION - EDA, GR-06 - ELECTRONIC DESIGN AUTOMATION - EDA
Tipo tesi EXPERIMENTAL, HARDWARE DESIGN, SOFTWARE DEVELOPMENT
Descrizione This thesis will be carried out at the IMEC research center in Leuven, Belgium.
Modern computing demands are reaching unparalleled heights, and with them, the necessity for advanced, 3D Integrated Circuits (3D ICs) capable of propelling performance and scalability in our increasingly digital world. These stacked memory and logic blocks form the cornerstone of future technology, yet they present an intriguing thermal challenge due to their high power densities.
In this thesis, the candidate will explore system-level thermal dynamics within cutting-edge, multicore High-Performance Computing (HPC)/server architectures. The student will employ the 3D Interlayer Cooling Emulator (3D-ICE) - a state-of-the-art thermal CAD tool adept at solving heat transfer equations in intricate 3D structures and focusing on fast transient state thermal estimation. Namely, the candidate will employ 3D-ICE to benchmark thermal performance in the different 3D integration configurations with the vanguard of technology nodes, including various system architecture partitioning schemes: memory-on-logic, logic-on-memory, and memory-on-memory, investigated within the grand scope of a complete chip-substrate-package level design. Throughout this venture, the candidate will collaborate closely with a team of expert system architects and thermal designers at IMEC, to discover and unlock the potential of system-level thermal solutions.
Conoscenze richieste Electronic / Computer engineering, Experience with EDA tools for power and/or thermal analysis, C/C++, Python, basic knowledge of SOC packaging.
Note Thesis carried out at the IMEC research center in Leuven, Belgium, under the supervision of Dr. Francky Catthoor, Dr. Yukai Chen, and Dr. Dwaipayan Biswas. The candidate will be financially supported by IMEC for the travel (around 800/1000 Euro per month, not considering potential scholarships).
Scadenza validita proposta 08/08/2023
PROPONI LA TUA CANDIDATURA