| KEYWORD |
Pore Structure Investigation in Die Attach and Solder joints
Parole chiave MICROELETTRONICA, PROCESSI INNOVATIVI, TECNOLOGIE INNOVATIVE
Riferimenti VALENTINA BERTANA, SERGIO FERRERO, LUCIANO SCALTRITO
Gruppi di ricerca AA - Materials and Processes for Micro and Nano Technologies
Tipo tesi SPERIMENTALE APPLICATA
Descrizione Porosity is a common defect which occurs in solder joints. Porosity in surface mount joints will potentially cause weakening in joint strength and reduction in electrical and thermal conductivity. It will induce crack initiation and shorten the fatigue life of solder joints. In fact, pores contained in solder joints may intensify the stress and decrease joining strength between components and the PCB board tremendously. [1]
The thesis goal is to investigate pore formation and evolution in die attach and solder joints and discuss possible soldering process enhancements.
The work will be organised as follow:
• Literature review
• Samples creation
• Tests definition
• Results characterisation
[1] Xie et al., Porosity Formation and Its Effects on Mechanical Properties of SMT Solder Joints, 1994.
Scadenza validita proposta 30/03/2025
PROPONI LA TUA CANDIDATURA