| KEYWORD |
Area Engineering
Warpage Mitigation of Electronic Ceramic Substrates
keywords ELECTRONICS DEVICES, PCB DESIGN, EMBEDDED BOARD, VEHICULAR COMMUNICATIO
Reference persons VALENTINA BERTANA, LUCIANO SCALTRITO
Research Groups AA - Materials and Processes for Micro and Nano Technologies
Thesis type EXPERIMENTAL - DEVELOPMENT
Description Ceramic substrates are ubiquitous in modern electronics, providing a robust
platform for mounting electronic components. However, one critical issue that can
significantly impact the performance and reliability of these devices is warpage.
Warpage, a distortion or bending of the substrate, can arise from various factors,
including thermal expansion mismatches, internal stresses, and manufacturing
processes. [1]
The thesis seeks to understand and address the issue of warpage by simulating
potential solutions and validating them through sample production.
The work will be organised as follow:
• Literature review
• Design and FEM Simulation of warpage-optimised substrates
• Substrates Production
• Results characterisation
[1] Hu et al, Warpage deformation analysis of AMB ceramic substrates in power
modules, 2024
Required skills 3D CAD design
Design and FEM simulation
Deadline 13/12/2025
PROPONI LA TUA CANDIDATURA