KEYWORD |
Die Attach Process Optimisation for System-in-Package modules
Parole chiave DISPOSITIVI ELETTRONICI, PCB DESIGN, EMBEDDED BOARD, VEHICULAR COMMUNICATIO
Riferimenti VALENTINA BERTANA, LUCIANO SCALTRITO
Gruppi di ricerca AA - Materials and Processes for Micro and Nano Technologies
Tipo tesi SPERIMENTALE APPLICATA
Descrizione Die attach is a critical step in System-in-Package (SiP) manufacturing, ensuring reliable electrical and thermal connections between the die and the substrate. Many different techniques are available from soldering processes with traditional solder pastes, conductive adhesives, up to modern sintering techniques. Optimizing these processes is crucial for enhancing performance, reliability, and reducing manufacturing costs. [1]
The thesis seeks to optimise the die attach process exploring different soldering materials, techniques and substrate-device interfaces.
The work will be organised as follow:
· Literature review on the state-of-the-art die attach processes
· Experiments definition and parameters optimisation
· Results characterisation
[1] Shun Chin et al, A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices, 2010
Scadenza validita proposta 19/12/2025
PROPONI LA TUA CANDIDATURA