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Die Attach Process Optimisation for System-in-Package modules

Parole chiave DISPOSITIVI ELETTRONICI, PCB DESIGN, EMBEDDED BOARD, VEHICULAR COMMUNICATIO

Riferimenti VALENTINA BERTANA, LUCIANO SCALTRITO

Gruppi di ricerca AA - Materials and Processes for Micro and Nano Technologies

Tipo tesi SPERIMENTALE APPLICATA

Descrizione Die attach is a critical step in System-in-Package (SiP) manufacturing, ensuring reliable electrical and thermal connections between the die and the substrate. Many different techniques are available from soldering processes with traditional solder pastes, conductive adhesives, up to modern sintering techniques. Optimizing these processes is crucial for enhancing performance, reliability, and reducing manufacturing costs. [1]
The thesis seeks to optimise the die attach process exploring different soldering materials, techniques and substrate-device interfaces.
The work will be organised as follow:
· Literature review on the state-of-the-art die attach processes
· Experiments definition and parameters optimisation
· Results characterisation
[1] Shun Chin et al, A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices, 2010


Scadenza validita proposta 19/12/2025      PROPONI LA TUA CANDIDATURA