AI-Based Adaptive High-Speed Impact Force Control
Thesis in external company
keywords PCBA TEST, FLYING PROBE TESTERS
Research Groups DAUIN - GR-05 - ELECTRONIC CAD & RELIABILITY GROUP - CAD
Description Electronics and microelectronics are becoming increasingly complex and miniaturized, making it more difficult to contact at high speed and without damaging the increasingly small test pads, less than 30 microns, of semiconductor wafers, electronic boards and flexible circuits.
SPEA (where the thesis work will be performed) is the global leader in the production of Flying Probe Testers characterized by fast contact on both sides of the microelectronic devices of the latest technologies.
The aim of the thesis is the study and design of algorithms, the optimization of paths, the determination of the speed profiles and the force of the probes on the pads so that no damage is produced by impact and that they involve the least possible contact time.
The thesis student will be part of the Project Team in charge of the development, validation and characterization of the new functions of the Tester based on AI, Deep Learning, Industry 4.0 and the modern IT Geosystem.
The development with success of the thesis will allow the candidate to get the priority employment status for an engineering position in the New Technologies Design Office.
Notes SPEA offre i seguenti vantaggi agli studenti interessati:
1. Pranzo pagato per i giorni in SPEA, per tutta la durata dello stage.
2. Premio di 600 euro se l'incarico affidato sarÓ stato svolto con successo.
Deadline 07/02/2023 PROPONI LA TUA CANDIDATURA