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  KEYWORD

Area Engineering

Prof. LUCIANO SCALTRITO

3D Printing Ceramic Materials for Microelectronic Applications  BERTANA VALENTINA  AA - Materials and Processes for Micro and Nano Technologies
AI Techniques for the Optimisation of DBC Substrates for High Power Systems-in-Package (HPSiP)  BERTANA VALENTINA  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
AI Techniques for the Optimisation of Highly Integrated Power Modules  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
Additive manufacturing of ceramic materials  BERTANA VALENTINA  AA - Materials and Processes for Micro and Nano Technologies
Laser processes on packaging materials  BERTANA VALENTINA  AA - Materials and Processes for Micro and Nano Technologies
Modelling Pyroelectric Effect for Piezoelectric Sensor Integration  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
Packaging optimization for a microfluidic platform  BERTANA VALENTINA  FERRERO SERGIO
Piezoelectric Sensor Integration beyond linearity  BERTANA VALENTINA  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
Pore Structure Investigation in Die Attach and Solder joints  BERTANA VALENTINA  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
azienda TESI AZIENDA Power devices passivation layers: materials and processes optimization  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
Power semiconductor devices – Contact resistance  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
Silicon Carbide Schottky Barrier height formation and measurements  FERRERO SERGIO  AA - Materials and Processes for Micro and Nano Technologies
Warpage Mitigation of Electronic Ceramic Substrates  BERTANA VALENTINA  AA - Materials and Processes for Micro and Nano Technologies